Vapor chamber is one of highly effective thermally spread techniques in electronic cooling. In the following a work is conducted to evaluate thermal performance of 2.0 mm high and 50 mm diameter vapor chamber with water and methyl alcohol at different charge ratios. Also, a solution of water and Propylene Glycol at two concentration 50%, 15% were tested to study the effect of using surfactant as enhancement agent for working fluid. Also total thermal resistance of the chamber is divided into three types (junction resistance, internal resistance, and condenser resistance) to investigate and determine which type of thermal resistance has a major effect on chamber total thermal resistance.