Staff Members - Benha University
Effect of package spacing on convective heat transfer from thermal sources mounted on a horizontal surface
Applied Thermal Engineering • 2018
Publication Information
Authors
R.K. Ali , H.A. Refaey, M.R. Salem
Keywords
Electronic module
Convective
Numerical and experimental
Journal
Applied Thermal Engineering
Publisher
ScienceDirect
Volume
132
Issue
Not Available
Pages
676–685
publication.type
International
Paper Link
Open Link
Supplementary Materials
Not Available
Abstract
This work introduces a three-dimensional analysis of an inline module composed of two thermal sources
using ANSYS-FLUENT Computational Fluid Dynamics (CFD) package. The effect of package spacing ratio
(1 S 3) on the heat transfer coefficient of the upstream (UTS) and downstream (DTS) thermal sources
within Reynolds number range of 2464 6 ReL 6 16; 430 are considered. The predictions are compared
with the experiments performed on air wind tunnel with two thermal sources mounted on its horizontal
surface within Reynolds number range of 4848 6 ReL 6 13; 635. The numerical results are compared and
validated with the experimental results and a good agreement is obtained. Compared to a single thermal
source (STS), it is observed that the reduction in the average Nusselt number of the UTS and DTS is 26.3%
and 35.6%, respectively, at S = 1. This reduction decreases to 4.9% and 12.6%, respectively, at S = 3. Finally,
the present study aims to extend the printed circuit boards designers with average Nusselt number correlations
for the UTS and DTS as a function of Reynolds number and package spacing within
2464 6 ReL 6 16; 430 and (1 S 3).
using ANSYS-FLUENT Computational Fluid Dynamics (CFD) package. The effect of package spacing ratio
(1 S 3) on the heat transfer coefficient of the upstream (UTS) and downstream (DTS) thermal sources
within Reynolds number range of 2464 6 ReL 6 16; 430 are considered. The predictions are compared
with the experiments performed on air wind tunnel with two thermal sources mounted on its horizontal
surface within Reynolds number range of 4848 6 ReL 6 13; 635. The numerical results are compared and
validated with the experimental results and a good agreement is obtained. Compared to a single thermal
source (STS), it is observed that the reduction in the average Nusselt number of the UTS and DTS is 26.3%
and 35.6%, respectively, at S = 1. This reduction decreases to 4.9% and 12.6%, respectively, at S = 3. Finally,
the present study aims to extend the printed circuit boards designers with average Nusselt number correlations
for the UTS and DTS as a function of Reynolds number and package spacing within
2464 6 ReL 6 16; 430 and (1 S 3).