Nano-sized SiC particles-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared bymechanically dispersing SiC particles into plain SAC305 alloy at 900 °C for 90 min. The effects of SiC addi-tion on microstructure, melting behavior and tensile properties of as-cast SAC305 solders were system-atically investigated. The data from microstructure-properties analysis of composite solder show that thenano-sized SiC particles has significantly refined the microstructure, increased the strength and elasticmodulus in comparison with the plain SAC305 solder. In addition, SiC particles decrease the pasty rangeof composite SAC305-0.7SiC solder although the undercooling and eutectic temperature prolonged nearlyat the SAC305 level. A strain rate-dependent model of elastic modulus (E), yield stress (0.2%YS) and ulti-mate tensile strength (UTS) was developed based on the test results. The predicted tensile parameters forboth solders are reasonably close to the present experimental data