Staff Members - Benha University
Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0 Ag–0.5 Cu lead-free solder AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh Materials Science and Engineering: A 618, 389-397
Materials Science and Engineering: A • 2014
Publication Information
Authors
AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh
Keywords
Not Available
Journal
Materials Science and Engineering: A
Publisher
Elsevier
Volume
618
Issue
Not Available
Pages
389-397
publication.type
International
Paper Link
Not Available
Supplementary Materials
Not Available
Abstract
Abstract In the present study, nano-sized ZnO particle-reinforced Sn–3.0 Ag–0.5 Cu
(SAC305) composite solder was prepared by mechanically dispersing nano-particles into
SAC305 solder at 900 C for 2 h. The effects of ZnO addition on microstructure, melting
behavior and corresponding mechanical properties of SAC305 solder were explored.
Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing
both the β-Sn grain size and spacing between Ag 3 Sn and Cu 6 Sn 5 particles. The ...
(SAC305) composite solder was prepared by mechanically dispersing nano-particles into
SAC305 solder at 900 C for 2 h. The effects of ZnO addition on microstructure, melting
behavior and corresponding mechanical properties of SAC305 solder were explored.
Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing
both the β-Sn grain size and spacing between Ag 3 Sn and Cu 6 Sn 5 particles. The ...