| publication name | Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0 Ag–0.5 Cu lead-free solder AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh Materials Science and Engineering: A 618, 389-397 |
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| Authors | AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh |
| year | 2014 |
| keywords | |
| journal | Materials Science and Engineering: A |
| volume | 618 |
| issue | Not Available |
| pages | 389-397 |
| publisher | Elsevier |
| Local/International | International |
| Paper Link | Not Available |
| Full paper | download |
| Supplementary materials | Not Available |
Abstract
Abstract In the present study, nano-sized ZnO particle-reinforced Sn–3.0 Ag–0.5 Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900 C for 2 h. The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC305 solder were explored. Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing both the β-Sn grain size and spacing between Ag 3 Sn and Cu 6 Sn 5 particles. The ...