Nano-sized SiC particles-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing SiC particles into plain SAC305 alloy at 900 °C for 90 min. The effects of SiC addi-tion on microstructure, melting behavior and tensile properties of as-cast SAC305 solders were system-atically investigated. The data from microstructure-properties analysis of composite solder show that the nano-sized SiC particles has significantly refined the microstructure, increased the strength and elastic modulus in comparison with the plain SAC305 solder. In addition, SiC particles decrease the pasty range of composite SAC305-0.7SiC solder although the undercooling and eutectic temperature prolonged nearly at the SAC305 level. A strain rate-dependent model of elastic modulus (E), yield stress (0.2%YS) and ulti-mate tensile strength (UTS) was developed based on the test results. The predicted tensile parameters for both solders are reasonably close to the present experimental data.