Tungsten-copper composites with various copper nano-particles volume fractions were manufactured and examined. Tungsten-copper composites with 20 pct, 25 pct, and 30 pct volume fractions were mechanically mixed and sintered. spark plasma sintering (SPS) method was used for samples preparation at two different sintered temperatures 1273 K and 1373 K (1000 C and 1100 C). The effect of copper nano-particles on the bulk density, hardness, the coefficient of thermal expansion (CTE), electrical conductivity, and stress-strain behavior of the produced composites were studied. The hardness was found to decrease with the increase of the copper volume fraction in the composites. Conversely, the CTE and electrical conductivity increases with the increase of the copper volume fraction in the composites. Furthermore, the elastic modulus were extracted from tensile stress-strain behavior were found to increase with the increase of the copper volume fraction in the composites. Finally, the fracture surface roughness was studied using high resolution optical investigations and was noticeably higher with the increase of the copper volume fraction in the composites.