أعضاء هيئة التدريس - جامعة بنها
Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0 Ag–0.5 Cu lead-free solder AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh Materials Science and Engineering: A 618, 389-397
Materials Science and Engineering: A • 2014
معلومات البحث
المؤلفون
AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh
الكلمات المفتاحية
Not Available
المجلة العلمية
Materials Science and Engineering: A
الناشر
Elsevier
المجلد
618
العدد
Not Available
الصفحات
389-397
publication.type
International
رابط البحث
Not Available
المواد المرفقة
Not Available
الملخص
Abstract In the present study, nano-sized ZnO particle-reinforced Sn–3.0 Ag–0.5 Cu
(SAC305) composite solder was prepared by mechanically dispersing nano-particles into
SAC305 solder at 900 C for 2 h. The effects of ZnO addition on microstructure, melting
behavior and corresponding mechanical properties of SAC305 solder were explored.
Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing
both the β-Sn grain size and spacing between Ag 3 Sn and Cu 6 Sn 5 particles. The ...
(SAC305) composite solder was prepared by mechanically dispersing nano-particles into
SAC305 solder at 900 C for 2 h. The effects of ZnO addition on microstructure, melting
behavior and corresponding mechanical properties of SAC305 solder were explored.
Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing
both the β-Sn grain size and spacing between Ag 3 Sn and Cu 6 Sn 5 particles. The ...